TEGANGAN TEMBUS INTRINSIK ISOLASI RESIN EPOKSI BERPENGISI SiO2 MENGGUNAKAN METODE MCKEOWN TEST SPECIMEN

KHOIRULLAH, FAHRIZAHRAN and Nawawi, Zainuddin (2021) TEGANGAN TEMBUS INTRINSIK ISOLASI RESIN EPOKSI BERPENGISI SiO2 MENGGUNAKAN METODE MCKEOWN TEST SPECIMEN. Undergraduate thesis, Sriwijaya University.

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Abstract

The purpose of this experiment was to obtain the intrinsic breakdown voltage of the epoxy resin dielectric which was filled with SiO2 filler. This investigation is carried out using McKeown Test Specimen method with a thickness of sample is 1 mm. The Epoxy resin that used in this test is a crystal clear color with Eposchon brand. The investigation results show an effect from the addition of SiO2 nanofiller on the dielectric strength of the epoxy resin in resisting electrical stress. Addition of SiO2 was able to increase the dielectric strength of the sample to withstand the given mechanical stress. The increase in breakdown voltage of epoxy resin dielectric while given the addition of 0.999% SiO2 for 1 wt% filler, meanwhile in the filler of 3 wt% can increase up to 1.922% when compared to pure epoxy resin. In general resin filled with SiO2 nanofiller until 3 wt% will increase the breakdown strength in resin material dielectric.

Item Type:	Thesis (Undergraduate)
Uncontrolled Keywords:	Tegangan Tembus, Resin Epoksi, SiO2
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK452-454.4 Electric apparatus and materials. Electric circuits. Electric networks
Divisions:	03-Faculty of Engineering > 20201-Electrical Engineering (S1)
Depositing User:	Fahrizahran Khoirullah
Date Deposited:	01 Oct 2021 03:15
Last Modified:	01 Oct 2021 03:15
URI:	http://repository.unsri.ac.id/id/eprint/55422

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