PERBANDINGAN KEBOCORAN MIKRO TUMPATAN KLAS I RESIN KOMPOSIT BULK FILL MENGGUNAKAN BONDING UNIVERSAL ADHESIVE STUDI DENGAN MODE TOTAL ETCH DAN SELF ETCH

ANNISA, SITI and Sujatmiko, Billy and Mozartha, Martha (2021) PERBANDINGAN KEBOCORAN MIKRO TUMPATAN KLAS I RESIN KOMPOSIT BULK FILL MENGGUNAKAN BONDING UNIVERSAL ADHESIVE STUDI DENGAN MODE TOTAL ETCH DAN SELF ETCH. Undergraduate thesis, Sriwijaya University.

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Abstract

Background: Bulk fill resin composite was developed to minimize shrinkage during polymerization, can be filled to a depth of 4 mm. Bonding agent is a element that takes an important role in the ability to avoid microleakage restorations. The purpose of this is study to compare the microleakage of various bulk fill composite resin filled in class I cavity using bonding universal adhesive with mode total etch dan mode self etch with bulk technique. Methods: Eighteen human maxillary premolars were stored in aquades. Samples was planted into a cast box and class I cavities were prepared. Samples were divided into two groups, group 1 filled with bulk fill bonding universal adhesive mode total etch composite resin and group 2 with bulk fill bonding universal adhesive mode self etch composite resin. Samples were stored in an incubator at 37oC for 24 hours. Samples were manually thermocycled for 100 times at 5oC and 55oC, then immersed in 1% methylene blue solution for 24 hours. Samples were sectioned with separating disc. Microleakage were measured by Digital USB Microscope with 100x magnification in milimeters from occlusal wall. Result: Microleakage bonding agent universal adhesive mode total etch showed lower microleakage than mode self etch in class I cavity bulk fill composite resin filled. Conclusion: There is a difference of microleakage of class I bulk fill composites between bonding universal adhesives where bonding universal adhesive with mode total etch results in lower microleakage than bonding universal adhesive with mode self etch. Keywords: Class I cavity, Microleakage, Bulk fill composite resin, Universal adhesive bonding mode total etch and self etch.

Item Type:	Thesis (Undergraduate)
Uncontrolled Keywords:	Kavitas klas I, Kebocoran mikro, Resin komposit bulk fill, Bonding universal adhesive mode total etch dan self etch.
Subjects:	R Medicine > RK Dentistry > RK501-519 Operative dentistry. Restorative dentistry
Divisions:	04-Faculty of Medicine > 12201-Dentistry (S1)
Depositing User:	Siti Annisa
Date Deposited:	06 Dec 2021 01:39
Last Modified:	06 Dec 2021 01:39
URI:	http://repository.unsri.ac.id/id/eprint/58752

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